The move to the 32-nm node and beyond presents unique challenges
for the semiconductor industry. Ultra-low k1 production techniques mean it will no
longer be enough to consider IC design, mask creation, lithography and metrology
in isolation. Instead we will need a new integrated approach to IC manufacture. The ability to optimize multiple IC production steps simultaneously is fundamental to ASML's Holistic Lithography vision.

As part of ASML's Holistic Lithography approach, FlexRay^TM programmable illumination and BaseLiner^TM scanner stability optimize and stabilize manufacturing process windows. The integration of Tachyon SMO and FlexRay provides unmatched co-optimization of mask and illumination source for the largest possible process window.