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TWINSCAN

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The TWINSCAN XT:1900Gi Step-and-Scan system is a high-productivity, dual-stage immersion lithography tool designed for volume 300-mm wafer production at 45-nm resolution and below. Building on the successful in-line catadioptric lens design concept first employed in the XT:1700Fi this system offers the highest NA in the industry: 1.35. The compact mechanically stable lens design has the same image orientation as refractive designs, allowing for full reticle compatibility between refractive designs as well as the XT:1700Fi. The illuminator features polarization at maximum throughput, and extremely homogeneous pupil fill, perfectly adapted to ultra low-k1 pupil shapes.

Standard as well as customized illumination modes can be enhanced by optimizing the polarization mode, to maximize the contrast and reducing the mask error factor per application. Overlay and focus performance are improved in line with the resolution node. Besides polarization capability, the XT:1900Gi comes equipped with an extended Ultra-k1 package, consisting of QUASAR XL, LithoGuide ILIAS, DoseMapper, Reticle Shape Correction, CDFEC and Focus Spot Monitor.
Key Features and Benefits

1.35-NA 193-nm Catadioptric Projection Lens
Production resolution down to 45 nm (annular) and 40 nm (dipole). In-line catadioptric lens design, supporting full 26x33-mm field, 4X reduction and reticle compatibility with existing lens designs.

Immersion Dual-Stage Technology
Dual-stage operation with high-speed closing disk supports continuous water flow during stage swap with minimum overhead. Highest immersion throughput at maximum stability.

AERIAL XP Polarized Illuminator
Enables extended range of conventional and off-axis illumination. Polarization significantly reduces the mask error factor, and can increase the resolution by up to 5 nm, at full throughput.

6-kHz ArF Laser Technology
The perfect combination of high laser power for high throughput and efficient use of laser pulses for the lowest possible laser cost of operation and optimum dose performance.
Lens Field SizeOverlay Throughput
NAResolutionX & Y16-point
Alignment
300 mm Wafers
30 mJ/cm2 (125 shots)
Variable
0.85-1.35
< 40 nm26 X 33 mm< 6 nm*> 131 wph
* Single machine overlay includes TOP package