The TWINSCAN XT:1900Gi Step-and-Scan system is a high-productivity,
dual-stage immersion lithography tool designed for volume 300-mm wafer
production at 45-nm resolution and below. Building on the successful in-line
catadioptric lens design concept first employed in the XT:1700Fi this system
offers the highest NA in the industry: 1.35. The compact mechanically stable
lens design has the same image orientation as refractive designs, allowing for
full reticle compatibility between refractive designs as well as the XT:1700Fi.
The illuminator features polarization at maximum throughput, and extremely
homogeneous pupil fill, perfectly adapted to ultra low-k1 pupil
shapes.
Standard as well as customized illumination modes can be enhanced by
optimizing the polarization mode, to maximize the contrast and reducing the mask
error factor per application. Overlay and focus performance are improved in line
with the resolution node. Besides polarization capability, the XT:1900Gi comes
equipped with an extended Ultra-k1 package, consisting of QUASAR XL,
LithoGuide ILIAS, DoseMapper, Reticle Shape Correction, CDFEC and Focus Spot
Monitor.
Key Features and Benefits
1.35-NA 193-nm Catadioptric Projection Lens
Production resolution down to 45 nm (annular) and 40 nm (dipole). In-line catadioptric lens design, supporting full 26x33-mm field, 4X reduction and reticle compatibility with existing lens designs.
Immersion Dual-Stage Technology
Dual-stage operation with high-speed closing disk supports continuous water flow during stage swap with minimum overhead. Highest immersion throughput at maximum stability.
AERIAL XP Polarized Illuminator
Enables extended range of conventional and off-axis illumination. Polarization significantly reduces the mask error factor, and can increase the resolution by up to 5 nm, at full throughput.
6-kHz ArF Laser Technology
The perfect combination of high laser power for high throughput and efficient use of laser pulses for the lowest possible laser cost of operation and optimum dose performance.
|
Lens
| Field Size | Overlay |
Throughput
|
| NA | Resolution | X & Y | 16-point Alignment | 300 mm Wafers 30 mJ/cm2 (125 shots) |
Variable
0.85-1.35 | < 40 nm | 26 X 33 mm | < 6 nm* | > 131 wph |
* Single machine overlay includes TOP package