The move to the 32-nm node and beyond presents unique challenges for the semiconductor industry. Ultra-low k1 production techniques mean it will no longer be enough to consider IC design, mask creation, lithography and metrology in isolation. Instead, we will need a new integrated approach. The ability to optimize multiple production steps simultaneously is fundamental to ASML's Holistic Lithography vision.

ASML's Brion Technologies is a worldwide leader in computational lithography. Brion's Tachyon^TM platform, a highly accurate and ultra-fast OPC and OPC verification system, provides unique capabilities that address the interrelated challenges of design, photomask making and wafer printing for semiconductor manufacturing

Find out more at www.brion.com