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TWINSCAN NXT:1950i

193-nm Step & Scan

  • 1.35-NA 193-nm Catadioptric Projection Lens
  • Comprehensive Illumination Flexibility for Low-k1 Imaging
  • New Generation of Dual-Stage Immersion Technology
  • Unprecedented Overlay Performance
  • In-situ Metrology per Wafer Exposed
  • Increased Productivity

The TWINSCAN NXT:1950i Step-and-Scan system is a high-productivity, dual-stage immersion lithography tool designed for volume production 300-mm wafers at the 32-nm node and beyond.

Building on the successful in-line catadioptric lens design concept of the XT:1950Hi, the TWINSCAN NXT:1950i has a numerical aperture (NA) of 1.35 – the highest in the industry.
In-situ measurement and correction of optic aberrations enable maximum imaging performance for each wafer exposed when imaging at very low-k
1.

The TWINSCAN NXT:1950i introduces ASML's new generation of dual scanning stage operating concurrently and independently. The innovative magnetic levitation technology allows significant acceleration and precision gain enabling the TWINSCAN NXT:1950i to achieve unprecedented productivity and overlay performance.

Advanced in-situ metrology per wafer together with a comprehensive set of options to seamlessly input off-line metrology data to the scanner enable maximum overlay, focus and CDU performances on product wafers.

By combining enhanced image resolution, unprecedented overlay and productivity performance with CD uniformity and focus performance, the TWINSCAN NXT:1950i will address the challenge of single exposure and double patterning and be a cost-effective solution for the 32-nm node and beyond.

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