ASML on 9 July 2012 announced a customer co-investment program to accelerate ASML's development of Extreme Ultraviolet (EUV) technology beyond the current generation and ASML's development of future 450 mm silicon wafer technology.

Three customers – Intel, TSMC and Samsung – agreed to contribute EUR 1.38 billion to ASML's research and development of next-generation lithography technologies over five years. As part of the Customer Co-Investment Program, but separate from the R&D contribution, Intel, TSMC and Samsung each agreed to acquire ASML shares, equal to an aggregate 23 percent minority equity stake in ASML for EUR 3.85 billion in cash. The entire cash proceeds of the share issuance will be returned to ASML shareholders (not including participating customers) through a synthetic buy-back.

On this page you will find links to additional information on the Customer Co-Investment Program, including, presentations, filings, relevant press releases and a video interview with ASML Chief Financial Officer Peter Wennink.