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ASML Holistic Lithography

The move to the 32-nm node and beyond presents unique challenges
for the semiconductor industry. Ultra-low k1 production techniques mean it will no
longer be enough to consider IC design, mask creation, lithography and metrology
in isolation. Instead we will need a new integrated approach to IC manufacture. The ability to optimize multiple IC production steps simultaneously is fundamental to ASML's Holistic Lithography vision.

As part of ASML's Holistic Lithography approach, FlexRayTM programmable illumination and BaseLinerTM scanner stability optimize and stabilize manufacturing process windows. The integration of Tachyon SMO and FlexRay provides unmatched co-optimization of mask and illumination source for the largest possible process window.

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