How we do it
Open Innovation for better results
The way we work together in our ecosystem of suppliers, partners and customers is something we call ‘Open Innovation’. We are proud of this form of collaboration, which is based on building mutual trust and managed self-interest. It is a belief that has shaped ASML from its earliest years: we have always seen ourselves as architects and integrators, inspiring our partners to innovate on the cutting edge of engineering together, each in their own strength, all the while sharing risk and reward. Open Innovation expands the knowledge and skills of all partners involved, bringing technology to a higher level faster than any one partner could have done alone.
Sustained R&D, fast engineering cycles
We innovate across our entire product portfolio at the same pace as our customers through large and sustained investment in research and development. To accelerate our product development, we engineer in parallel what may usually happen sequentially, all the while guarding the product’s reliability, manufacturability and serviceability. This enables us to get our innovations into the hands of chipmakers faster. We collaborate closely with chipmakers to understand how our technology best fits their needs, challenges and visions of the future. It is through this collaboration and trust that we can build for today and develop for tomorrow.
Diversity fosters great ideas
The whiteboard is our favorite forum. We sketch our ideas on them, and only the best ones stay put. To get to the best ideas, we question everything while keeping an open, curious mind. We know that a great idea can come from anyone, so we foster a melting pot of different backgrounds, talents and passions. We are proud of that diversity and we know that it makes us stronger.
We get the job done together
We innovate as one team around the world. We have a strong sense of pride, shared purpose and foster a knowledge-based culture. These are the characteristics that enable us to push the boundaries of technology further and further.
Page updated on 2018-2-5 0:00 CET