7 days ago - req11131
Mechanical Engineer Electronics Packaging
Research & development
In a nutshell
Wilton - CT, US
Research & development
ASML brings together the most creative minds in science and technology to develop lithography machines that are key to producing faster, cheaper, more energy-efficient microchips. We design, develop, integrate, market and service these advanced machines, which enable our customers - the world’s leading chipmakers - to reduce the size and increase the functionality of their microchips, which in turn leads to smaller, more powerful consumer electronics. Our main headquarters are located in Veldhoven, the Netherlands, and we also have 18 office locations around the United States- including main offices in Wilton, CT, Chandler, AZ, San Jose, CA and San Diego, CA.
As a Mechanical Engineer- Electronics Packaging specialist, you will be responsible for developing portions of the lithography system and/or associated tooling related to the electronics infrastructure.
The position requires highly motivated, extremely organized and self-driven individuals.
ASML is a world leader in the manufacture of advanced technology systems for the semiconductor industry.ASML’s corporate headquarters is in Veldhoven, the Netherlands. Manufacturing sites and research and development facilities are located in Connecticut, California and the Netherlands. Technology development centers and training facilities are located in the United States, Japan, Korea, the Netherlands, and Taiwan. Additionally, ASML provides optimal service to its customers via over 50 sales and service organizations in 16 countries. Founded in the Netherlands in 1984, the company is publicly traded on Euronext Amsterdam and NASDAQ under the symbol ASML.
As a Mechanical Engineer- Electronics Packaging Specialist you will:
-Perform mechanical design and development associated with packaging electronic circuits including, assembly design, analysis, test, and manufacturing introduction support for both new and existing electronics design projects.
-Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design.
-Communicate with a team of multi-disciplined engineers (Systems , Electrical, Mechanical, Manufacturing, New Product Logistics, and Product Information Management) for design and logistic release approval.
-Investigate and edit product structures, generate CAD models, 2D/3D drawings and be responsible for the final technical data package.
-Create, edit, review, and drive Engineering Changes to closure.
Self-Checking and Peer-Checking department designs and change notifications.
BS Engineering with a major in any of the following:
-Mechanical Engineering (with Electronics Packaging Experience preferred).
-Industrial Engineering (taken under advisement based on work experience).
or equivalent experience.
-5 to 10 years of Mechanical design & logistics.
-Ability to design and document all aspects of the electrical infrastructure including:
AC, DC, Main power distribution (panel boards, boxes and cabinets).
Interconnect cables, bundles and connectors (harnessing).
Electronic racks, cabinets, control consoles.
Interfacing with printed circuit board designs.
-Modeling of flex and rigid PWB’s including volumes and critical part locations.
-Experience designing electronic enclosure assemblies.
-Experience in sheet metal design.
-Experience designing for manufacturability (DFM) and developing assembly work instructions for low to medium volume products.
-Experience with 3D solid modeling for design conceptualization and realization (preferred experience using NX).
-Experience supporting design fit check during integration & testing of electrical & electronic systems at the module, sub-system & system level.
-Knowledgeable of industry codes and standards ( i.e. NEC 70, NFPA 79, Machine Tool Standards).
-Knowledge of FEA is a plus.
-Working knowledge of wiring diagrams and schematic diagrams.
-Working knowledge of design drafting best practices including geometric dimensioning.
Perform dimensional and tolerance analysis as needed.
-Strong written and verbal communication skills required.
Ability to write assembly, test procedures, test specifications and test reports.
-3D CAD - NX preferred (currently using NX11), other 3D CAD programs acceptable.
-DMS - TeamCenter preferred (currently using TC10), other DMS programs acceptable.
-Master Data - SAP, other Master Data Management systems acceptable.
Context of the position
The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
-While performing the duties of this job, the employee routinely is required to sit; walk; talk; hear; use hands to keyboard, finger, handle, and feel; stoop, kneel, crouch, twist, reach, and stretch.
-The employee is occasionally required to move around the campus.
-The employee may occasionally lift and/or move up to 20 pounds.
-May require travel dependent on company needs.
-Specific vision abilities required by this job include close vision, color vision, peripheral vision, depth perception, and ability to adjust focus.
-Can work under deadlines.
-The environment generally is moderate in temperature and noise level.
-Must be able to read and interpret data, information, and documents.
-Can observe and respond to people and situations and interact with others encountered in the course of work.
-Can learn and apply new information or skills.
EEO/AA (W/M/Vets/Disability) Employer.