20 days ago - req19711

Memory/3D Process Technology Expert

Research & development

Physics

In a nutshell

Location

Tokyo, Japan

Team

Research & development

Experience

8+ years

Degree

Master

Job Category

Physics

Introduction

This position belong to Technology Development Center(TDC) within ASML. TDC directs industry technology. This position is expected to have good understanding in industry to create future technology. Japanese and English fluency on Business is required.

Job Mission

-Understand, analyze, and report latest memory and 3D process technology trends and roadmap for NAND, DRAM and CIS devices
-Study and report long-term projections of memory and 3D process technology options

Job Description

-Understand latest memory devices and 3D process technology options and impact on lithography requirements through interactions with customers, peer suppliers and industry experts
-Build process flow of memory/CIS devices and lithography requirements of them for various proposed options including both monolithic and wafer bonding
-Define memory and 3D process roadmap of NAND, DRAM and CIS devices together with the memory team in TDC
-Understand technical and economic challenges of future memory and 3D process technology options
-Provide technical consultation of memory and 3D process technology to senior management and stakeholders in ASML

Education

Ph.D. or Master’s degree in a Science or Engineering discipline

Experience

-Minimum 15 years of experience in memory(DRAM, CMOS image sensor) and 3D process technology R&D
-Outstanding knowledge on memory and 3D technologies covering device, design, integration
-Additional knowledge of lithography is preferred

Personal skills

Japanese and English fluency on Business is required.