30+ days ago - req24973

D&E - IC Design Engineer - Tainan/Hsinchu

Research & development

Electrical engineering

In a nutshell

Location

Tainan, Taiwan

Team

Research & development

Experience

3-7 years

Degree

Master

Job Category

Electrical engineering

Travel

10%

Introduction

ASML, including its affiliates and subsidiaries, bring together the most creative minds in science and technology to develop the most advanced electron beam defect inspection. We design, develop, integrate, market and service these advanced machines, which enable our customers - the world’s leading chipmakers – to identify the defects on their microchips and improve their processes. Be a IC designer, you can participate in this wonderful journey and make this world different.

Job Mission

As an Application-specific integrated circuit (ASIC) design engineer, you will have the chance to join D&E team to work on the advanced analog and mixed signal ASIC for next generation electron detection channel for the leading edge e-beam inspection and metrology systems. Your contributions will help the world’s leading chipmakers to improve the performance of products. Our customers will benefit from the performance improvements of products so that they can make more advanced chips with improved yield.

Job Description

1. Develop the functional blocks of high-speed Analog-to-Digital Converter (ADC) and/or Phase-Locked Loop (PLL) in ASIC for the detection channel of electron beam inspection tools, including:
- Define the design specifications of the Read-Out Integrated Chip (ROIC) or chipset based on product roadmap and System Performance Specifications (SPS) defined by system engineer.
- Develop new circuit architecture and technical solutions for next generation ASICs in detection channel, including feasibility study, schematic design, pre-layout simulation, layout design, and post-layout simulation.
- Cooperate with Printed Circuit Board (PCB) designer to design Evaluation Board (EVB) and with test engineer to test and characterize the ASICs.
- Create Element Design Specifications (EDS) and Test Performance Specifications (TPS) based on detail ASIC design and chip test/verification.
2. Cooperate with IC design partner to develop the ASICs for detection channel of of electron beam inspection tools, including:
- Review the detail schematic and layout design, TPS, and test results from our partner during the ASIC industrialization phase.
- Together with the engineering team from the partners, identify design solutions to achieve the specifications of the module/function. Review the design details and simulation results from our partner.
3. Support module level and sub-system level integration
4. Generate and / or review related IP documents

Education

- Ph.D. with 2+ years of hands-on experiences, or master with 5+ years hands-on experiences, or bachelor with 8+ years hands-on experiences
- Major in Electrical or Electronics Engineering

Experience

1. Minimum qualifications:
- Familiar with simulation and verification tools from Cadence
- High performance (high speed, high analog bandwidth and high bit resolution: sample rate goes beyond 1 GS/s, analog bandwidth goes beyond 500MHz, bit resolution goes beyond 10 bits) ADC design, layout, tape-out and test experiences
- High performance PLL and/or DLL design , layout, tape-out and test experiences with comprehensive understanding about phase noise and method to reduce phase noise
- Comprehensive understanding about high performance timing circuit (timing resolution down to at least ps level), timing jitter
- High precision voltage reference (e.g., band gap voltage reference), current source, current mirror, and linear regulator design, layout, tape out and test experiences
- Analog switch / analog multiplexer (with or without buffer) design, layout, tape out and test experiences with comprehensive understand about charge injection effect in circuit and the method about charge injection effect reduction / cancellation
- Familiar with test equipment such as multi-meter, SMU, signal / function generator, oscilloscope, signal / spectral analyzer, and network analyzer.
2. Plus:
- Familiar with semiconductor device physics and processes
- High precision voltage reference (e.g., band gap voltage reference), current source, current mirror, and linear regulator design, layout, tape out and test experiences
- Analog switch / analog multiplexer (with or without buffer) design, layout, tap e out and test experiences with comprehensive understand about charge injection effect in circuit and the method about charge injection effect reduction / cancellation
- High performance OPA, OTA, TIA, CTA, LNA and buffer / cable driver design, layout, tape out and test experiences
- High performance variable gain amplifier (VGA) design and / or programmable gain amplifier (PGA) layout, tape out and test experiences
- DDS IC design, layout, tape out and test experiences
- CMOS image sensor design, layout, tape out and test experiences
- Passive and active filter design, layout, tape out and test experiences
- Familiar with PCB design and manufacture

Personal skills

- Can observe and respond to people and situations and interact with others encountered in the course of work.
- Can learn and apply new information or skills.
- Must be able to read and interpret data, information, and documents.
- Strong customer focus and commitment to customer satisfaction through prioritization, quality, efficiency and professionalism.
- Ability to complete assignments with attention to detail and high degree of accuracy.
- Proven ability to perform effectively in a demanding environment with changing workloads.
- Result driven-demonstrate ownership and accountability.
- Identifies bottlenecks and drives improvements.
- Work independently or as part of a team and follow through on assignments with minimal supervision.
- Demonstrate open, clear, concise and professional communication.
- Ability to establish and maintain cooperative working relationships with co-workers and customer.
- Work according to a strict set of procedures within the provided timelines.

Context of the position

- Location in HMI Hsinchu or Tainan office
- Oversea business trip requirement according to project basis task.

Other information

- Good written and verbal communication skills.
- Good team work ability.
- Excellent analytical skills and being able to do trouble-shooting in a logical way.


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