5 days ago - req26600

Physics / Mechanical Engineering Internship: Literature study on backside wire bonding

Research & development

Physics

Mechanical engineering

In a nutshell

Location

Veldhoven, Netherlands

Team

Research & development

Experience

No experience (Student)

Degree

Master

Job Category

Physics, Mechanical engineering

Introduction

Are you a Master undergraduate student in Physics or Mechanical Engineering? Do you have an interest in Manufacturing Reliability? Then this assignment could be interesting for you!

Background Information

The group Sensors Mechanics is part of the cluster Mechanical Development and is responsible for the design of optical sensor systems, like interferometers and image sensors.

Part of the development portfolio of this group are the so-called image sensors – different types - which are located on top of the wafer stage and are used to measure e.g. the position of the focal plane of the projection lens, the light energy, optical aberrations and the position of the stage with respect to a reference. All these sensors have in common that they use an optical element, custom made from a silicon wafer, with light sensitive diodes. These are connected to a small electronics board inside the sensor housing. The diodes are connected with the electronics board, by wire bonding. This can be done by front side (top side of) or backside wire bonding. The latter choice results in a more compact design, but introduces a complexity: inside the silicon, wafer based optical element, electrically insulated connections must be present to conduct the diode signals from top to bottom of the element. Also so called wire bond pads must be present for the wire bonding.

Your Assignment

The task is to conduct a literature study in order to track down and investigate existing and industrialized methods which can potentially be used to realize a backside wire bonding solution. During your assignment you will be in touch with mechanical and physics sensor architects.

You will:
 conduct a literature study with respect to existing methods related to backside wire bonding;
 propose a ranking based on the most feasible existing method;
 in case an existing method doesn’t qualify, propose another solution;
 the study should result in a report describing the results and potential solutions.

Your Profile

• You are a Master student with a background in Physics or Mechanical Engineering;
• You have an interest in manufacturing reliability;
• You are solution oriented and communicative strong.

This is a Master apprentice internship for 5 days a week with a duration of about 3 months. The start date is in September 2021.

This position requires access to U.S. controlled technology, as defined in the United States Export Administration Regulations. Qualified candidates must be legally authorized to access such U.S. controlled technology prior to beginning work. Business demands may require ASML to proceed with applicants who are immediately eligible to access U.S. controlled technology.

Please note that we can only consider students who are enrolled at a university for the entire duration of the internship.

Other information

What ASML offers
Your internship will be in one of the leading Dutch corporations, gaining valuable experience in a highly dynamic environment. You will receive a monthly internship allowance based on your educational level and number of days per week, plus a possible housing or travel allowance. More information on the allowances can be found on our website. In addition you will get expert, practical guidance and the chance to work in and experience a dynamic, innovative team environment.

ASML: Be part of progress
We make machines that make chips – the hearts of the devices that keep us informed, entertained and safe; that improve our quality of life and help to tackle the world’s toughest problems.

We build some of the most amazing machines that you will ever see, and the applications to run them. Never satisfied, we measure our performance in units that begin with pico or nano.

We believe we can always do better. We believe the winning idea can come from anyone. We love what we do – not because it’s easy, but because it’s hard. At ASML we are always pushing technology further.

Students: Getting ready for the real-world
Teamwork is key within ASML. Our R&D team is more than 5,500 people strong and worldwide we form one big team with over 25,000 employees. These colleagues have 123 different nationalities and work at our major sites on three continents.

Dozens of diverse, interdisciplinary teams work in parallel to meet a challenging development schedule. In this inspiring environment, your colleagues may be sitting next door, or they could be thousands of kilometers away in a different country, or even working for a different company.

An internship at ASML is your opportunity to get to know this world and get a feel for that excites you most. Use your education, gain real-life working experience and explore the world of high-tech – all at the same time.

How will you be part of progress?