ASML is one of the world’s leading manufacturers of chip-making equipment. Headquartered in Veldhoven, the Netherlands, ASML employs more than 14,000 people.
The PAS 5500/8TFH-A KrF Step-and-Scan system is a dedicated lithography tool for thin-film head (TFH) production on 125-mm, 150-mm, and 200-mm AlTiC wafers.
It combines a powerful, variable NA up to 0.8 lens with the proven thick AlTiC wafer handling of a PAS body and specific alignment improvements for the TFH environment.
The result is a new standard for TFH production at current and future technology nodes.
TFH manufacturing involves printing sub-100-nm isolated features, which demands extremely low lens aberration levels. The PAS 5500/8TFH-A uses the proven ultra-low aberration KrF lens from the XT platform on the PAS body, ensuring excellent performance and a low cost of ownership. The low thermal conductivity of AlTiC wafers means maximum throughput on the track is restricted, allowing the PAS 5500/8TFH-A more time for alignment and wafer stabilization. In addition, the PAS 5500/8TFH-A features further improvements to the dynamics.
Together, these translate into industry-leading overlay and stitching performance on AlTiC wafers.
|Resolution:||≤ 110 nm|
|Distortion (Dynamic):||≤ 9 nm|
|Image plane deviation:||≤ 55 nm|
|Astigmatism:||≤ 40 nm|
|Single-machine on AlTiC:||≤ 8 nm|
|Matched-machine on AlTiC:||≤ 17 nm|
|Stage grid verification XY, YX on AlTiC:||< 8 nm|
|Colinearity using 3 fields for 2" rowbars on AlTiC:||< 15 nm|
Wafer Throughput50-mJ/cm2 exposure dose, for critical overlay layers
Illumination and Dose Control
|Integrated slit uniformity:||≤ 0.5%|
|Beam Delivery:||≤ 20-m remote capability|
Enables user-defined wafer accommodation, meandering routing in X, and system start-up via the job definition to provide stable production performance for small AlTiC wafer batch sizes in combination with TFH-specific off-line data analysis software.
Proven AlTiC Wafer Handling
Proven handling of 1.2 mm thick (125 mm, 150 mm or 200 mm diameter) and 2.0 mm thick (125 mm and 150 mm diameter) AlTiC wafers.
KrF Starlith 870 Projection Lens with Variable NA Up to 0.80
Ultra-low aberration levels enable isolated line imaging below 90 nm.
UNICOM enables automatic optimization of the slit uniformity per illumination setting. Meanwhile, the automatic DOE exchanger (ADE) can hold up to 5 Diffractive Optical Elements (DOEs).
The latest overlay capability configuration.
PAS 5500 Step-and-Scan Body
Improved dynamics and interferometer control enable best-in-class performance.
Multiple Exposure Technique
Enables different illumination modes and imaging settings with multiple masks, and allows user-defined image sequence orders.