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TWINSCAN NXE:3400B

  • Projection Lens
  • Illumination System
  • Overlay
  • Focus Control and Field-by-Field Leveling
  • Throughput
  • User Interface LINUX Architecture
  • Plasma Source

The TWINSCAN NXE:3400B will support EUV volume production at the 7 and 5 nm nodes. Combining productivity, excellent image resolution, matched overlay to EUV NXE and ArFi NXT tools and focus performance, the TWINSCAN NXE:3400B provides lithography capability complementary to ASML’s ArFi technology.

Improvements on the EUV source industrialization, overlay and focus enable a robust solution for cost effective volume production from 2018/2019 onwards.

The NXE Step-and-Scan systems use 13.5 nm EUV light, generated by a tin-based plasma source. The systems feature all-reflective 4x reduction lens assemblies from Carl Zeiss SMT with a maximum exposure field of 26 mm by 33 mm.

The NXE:3400B will be equipped with projection optics with NA 0.33 and a new illuminator with operating range sigma 0.06 - 1 to maintain high productivity while enabling low-k1 and a resolution of 13 nm.

In-situ measurement and corrections per wafer of the optics and stages enable maximum imaging performance of overlay and CDU for each wafer exposed when imaging at low-k1.

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ASML’s lithography machines are used to create microchips on the nanometer scale (that’s a millionth of a millimeter), which in turn enables electronic devices to become cheaper, faster and more…
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Video Interview: CFO Roger Dassen Q3 Financial Results 2018

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Investor Day 2018

Investor Day 2018

Finance

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Share Information

Year Overview - AEX

asml image
ASML share (15 min. delayed)
AEX:
NASDAQ:

Video Interview: CFO Roger Dassen Q3 Financial Results 2018

Video Interview: CFO Roger Dassen Q3 Financial Results 2018

Annual Report 2017

Annual Report 2017

ASML customer co-investment program

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세계에 나가 다양한 기회를 접하다.

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Jobs in San Diego

Our most recent vacancies are posted here on ASML.com.

Until the end of 2018, you will still find some San Diego jobs on our old careers site cymercareers.com.

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