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TWINSCAN NXT:1965Ci

193-nm Step and Scan

  • For customers in Germany, as of March 23, 2018 this product is only available in a new and modified version, and under a different model number.
  • 1.35-NA 193-nm Catadioptric Projection Lens
  • FlexRay Prepared Illuminator for Maximum Flexibility
  • Significant Advancement in Stage Technology
  • Vastly Improved Overlay Performance
  • Revolutionary In-situ Metrology
  • Increased Productivity and Reduced Defectivity
  • Litho-cell Stability and Performance Control

The TWINSCAN NXT:1965Ci Step-and-Scan system is a high-productivity, dual-stage immersion lithography tool designed for volume production 300-mm wafers at the sub 20-nm node. The TWINSCAN NXT:1965Ci offers optimum cost of ownership and is upgradeable to the performance of the TWINSCAN NXT:1970Ci.

Building on the successful in-line catadioptric lens design concept of the TWINSCAN NXT:1960Bi, the TWINSCAN NXT:1965Ci has a numerical aperture (NA) of 1.35 – the highest in the industry.

In-situ measurement and correction of optic aberrations enable maximum imaging performance for each wafer exposed when imaging at very low-k1.

The TWINSCAN NXT:1965Ci introduces a much improved version of the existing dual-stage concept in which stages can operate concurrently and independently. The improved stiffness and thus resulting improved dynamical performance allows significant acceleration and precision gain enabling the TWINSCAN NXT:1965Ci to achieve unprecedented focus and overlay at a significantly higher productivity level.

Advanced in-situ metrology per wafer together with a comprehensive set of options to input off-line metrology data to the scanner enable maximum overlay, focus and CDU performance on product wafers.

By combining high productivity and excellent image resolution with unprecedented overlay and focus performance, the TWINSCAN NXT:1965Ci addresses double patterning and multiple patterning requirements and thus provides a cost-effective solution for the sub 20-nm nodes.

 

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