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TWINSCAN XT:400L

365-nm Step and Scan

  • SMASH Sensor
  • Variable 0.65-NA 365-nm Projection Lens With Advanced Lens Manipulator And Imaging Enhancement Options
  • Dose Sum Check Feature
  • Extended Leveling Range
  • Improved Overlay TOP-2 for XT:400
  • Bridge Tool 200 mm - 300 mm

With the TWINSCAN XT:400L ASML introduces the next generation i-line Step and Scan system. In addition to increased productivity the XT:400L introduces new options to assist advanced applications with high topography (like 3D-NAND), and small CD and CDU (like critical layers in logic / analog application). Just like previous models the XT:400L is a dual-stage lithography tool designed for volume 200-mm and 300-mm wafers production down to 220-nm resolution.

The dual wafer stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment and mapping of the next wafer to take place in parallel, thereby virtually eliminating overhead time and allowing for continuous patterning of wafers. The level sensor, in combination with the TWINSCAN leveling approach, virtually eliminates differences between inner die and edge die and ensures high yield across the entire 300-mm wafer. Furthermore, new level strategies ensure that high level topographies are handled without problems. High throughput and yield are combined with fast reticle exchange times and Lot Streaming to provide the lowest cost of operation.

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