ASML is one of the world’s leading manufacturers of chip-making equipment. Headquartered in Veldhoven, the Netherlands, ASML employs more than 21,000 people.
The YieldStar S-1375F is a stand-alone metrology system that measures in-device overlay and CD for after-etch applications.
By utilizing the YieldStar S-1375F's unique high-NA system, customers can measure device overlay and CD with speed and accuracy. This capability enables hyper dense sampling and faster feedback of after-etch data to the TWINSCAN and etchers.
Overlay (In Device Metrology, 10x10 μm2 targets)
CD (In Device Metrology, 10x10 μm2 targets)
Overlay (In Device Metrology, 5x5 μm2 targets)
CD (In Device Metrology, 5x5 μm2 targets)
Building on the proven YieldStar S-375F platform, the YieldStar S-1375F implements specific innovations to improve in-device overlay and CD measurements. The YieldStar S-1375F enables the following applications:
On-product After-Etch Overlay and CD measurements for memory devices, using the actual device pattern
On-product After-Etch Overlay and CD measurements for logic devices, enabled by the use of small 5x5 μm targets
The YieldStar S-1375F provides much denser sampling compared to current metrology tools, based on electron beam metrology, improving move-acquire-measure (MAM) time by more than 25x. This innovation feeds advanced overlay control loops, in conjunction with ASML's Overlay Optimizer 3 and Pattern Fidelity Control enhancements.
Accuracy and Process Robustness
The YieldStar S-1375F re-uses the continuous wavelength concept from the YieldStar S-375F platform, enabling faster switching time, improving multi-wavelength acquisition move-acquire-measure time. Further improvements in the detection optics improve signal-to-noise of the measurement signal, increasing the accuracy and robustness of the YieldStar S-1375F measurement recipes.