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The NXT:2100i incorporates a new lens distortion manipulator that provides chipmakers with unprecedented correction capability. It enables the system to improve DUV-EUV cross-matching overlay.
Improved alignment accuracy is enabled by an increase from 4 to 12-color measurements and the addition of more alignment mark measurements on the wafer measure side. Various software algorithms have also been updated to deliver improved inter- and intra-field overlay control.
Other advances include improved thermal conditioning of the reticle, resulting in lower reticle-to-reticle temperature variation, and a new integrated sensor unit to improve lens metrology and reticle alignment accuracy.
These innovations will enable improved on-product overlay leading to higher yields of Memory and Logic chips that are printed using both deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography systems.
