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Our immersion systems lead the industry in productivity, imaging and overlay performance for high-volume manufacturing of the most advanced Logic and Memory chips.
Immersion systems are the workhorses of the industry. Our latest NXT machines have shown the ability to run in excess of 6,000 wafers per day, with an average five percent productivity increase over 12 months, supporting our customers' value requirements. We continue to innovate our immersion systems to meet the requirements of future nodes, benefiting from commonalities in R&D with our EUV program, while ensuring the platform’s extendibility through System Node Enhancement Package upgrades. Thanks to these packages, any NXT system can be upgraded to the latest technology.
The TWINSCAN NXT:2050i is a high-productivity, dual-stage immersion lithography tool designed for volume production of 300 mm wafers at advanced nodes.
The TWINSCAN NXT:2000i delivers outstanding overlay, focus control and cross-matching for high-volume manufacturing of advanced Logic and DRAM nodes.
The TWINSCAN NXT:1980Di delivers high productivity and reliability for volume production at advanced nodes with global system uptime >97%.
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain.
The industry’s most productive lithography platform yet is the first to go beyond 300 wafers per hour.
The TWINSCAN XT:1460K is a high-productivity dry ArF lithography tool with excellent overlay and imaging performance for volume production at 65 nm resolution.
The TWINSCAN XT:1060K is ASML’s most advanced KrF (krypton fluoride) laser 'dry' lithography system.
We continue to innovate in productivity, cost of ownership and performance across our TWINSCAN XT product lines (ArF, KrF and i-line), for both 200 mm and 300 mm wafer sizes. With 3D NAND Memory becoming mainstream, ASML has developed a broad portfolio of options for all dry systems, able to address the specific challenges of this technology, including high-topography layer stacks and wafer warpage, among others.
In 2016, due to the strong growth in IoT, automotive and industrial markets, we introduced a 200 mm version of the TWINSCAN XT scanners, which not only helps to increase the output of customer fabs, but is also used to replace aging lithography equipment in existing 200 mm fabs.