Metrology & inspection systems

Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.

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Together with our computational lithography and patterning control software solutions, our wafer metrology and inspection portfolio helps chipmakers achieve the highest yield and best performance in mass production of semiconductor chips.

YieldStar optical metrology

Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.

YieldStar 1385

Fast, accurate optical metrology of in-device overlay for post-etch process monitoring

YieldStar 1375F

Fast, accurate in-product overlay and CD metrology for after-etch process monitoring.

YieldStar 500

The YieldStar 500 is a stand-alone optical wafer metrology system for measuring pre-etch overlay leveraging ASML’s innovative TWINSCAN stage.

YieldStar 380G

The YieldStar 380G is the successor of the YieldStar 375F, providing even faster and more accurate after-develop overlay and focus measurements.

YieldStar 375F

Fast and accurate pre-etch overlay and focus measurements, whatever your process conditions.

E-beam metrology and inspection

Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.

HMI eScan 1100

The first generation multiple e-beam (multibeam) wafer inspection tool for in-line defect inspection applications

HMI eScan 1000

The world’s first multiple e-beam (multibeam) wafer inspection tool.

HMI eScan 600

Flexible e-beam inspection solution that detects multiple defect types in one system.

HMI eP5

Our highest resolution e-beam system offers CD metrology and defect detection for chip development and production monitoring.