Metrology & inspection systems

Delivering speed and accuracy, our metrology and inspection portfolio covers every step of the manufacturing process, from R&D to mass production.

01 / 29

Our YieldStar optical metrology solutions can quickly and accurately measure the quality of patterns on the wafer.

Fast, accurate optical metrology of in-device overlay for post-etch process monitoring

Fast, accurate in-product overlay and CD metrology for after-etch process monitoring.

The YieldStar 380G is the successor of the YieldStar 375F, providing even faster and more accurate after-develop overlay and focus measurements.

Fast and accurate pre-etch overlay and focus measurements, whatever your process conditions.

Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.

The first generation multiple e-beam (multibeam) wafer inspection tool for in-line defect inspection applications

The world’s first multiple e-beam (multibeam) wafer inspection tool.

Flexible e-beam inspection solution that detects multiple defect types in one system.

Our highest resolution e-beam system offers CD metrology and defect detection for chip development and production monitoring.

Related content