Metrology & inspection systems
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
Together with our computational lithography and patterning control software solutions, our wafer metrology and inspection portfolio helps chipmakers achieve the highest yield and best performance in mass production of semiconductor chips.
YieldStar optical metrology
Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
The YieldStar 500 is a stand-alone optical wafer metrology system for measuring pre-etch overlay leveraging ASML’s innovative TWINSCAN stage.
The YieldStar 380G is the successor of the YieldStar 375F, providing even faster and more accurate after-develop overlay and focus measurements.
Fast and accurate pre-etch overlay and focus measurements, whatever your process conditions.
E-beam metrology and inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
HMI eScan 1100
The first generation multiple e-beam (multibeam) wafer inspection tool for in-line defect inspection applications