Together with our computational lithography and patterning control software solutions, our metrology and inspection portfolio helps chipmakers achieve the highest yield and best performance in mass production.
YieldStar optical metrology
Our YieldStar optical metrology solutions can quickly and accurately measure the quality of patterns on the wafer.
Fast, accurate optical metrology of in-device overlay for post-etch process monitoring
Fast, accurate in-product overlay and CD metrology for after-etch process monitoring.
The YieldStar 380G is the successor of the YieldStar 375F, providing even faster and more accurate after-develop overlay and focus measurements.
E-beam metrology and inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
HMI eScan 430
Fast e-beam inspection for process development and production monitoring for 3D NAND and other advanced chips.
Our highest resolution e-beam system offers CD metrology and defect detection for chip development and production monitoring.