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ASML TWINSCAN NXE:3400 EUV lithography machine

EUV lithography systems

Using extreme ultraviolet (EUV) light, our NXE and EXE systems deliver high-resolution lithography and make mass production of the world’s most advanced microchips possible

EUV lithography does big things on a tiny scale. The technology, which is unique to ASML, prints microchips using light with a wavelength of just 13.5 nm – almost x-ray range. EUV is driving Moore’s Law forward and supporting novel transistor designs and chip architectures.

Leading-edge microchips contain billions of transistors. With each new generation (often referred to as a ‘node’), chipmakers pack in ever more and tinier transistors to make the chips more powerful, faster and energy efficient. Chips made with EUV lithography are enabling smart technology (cars, phones and homes), augmented reality, artificial intelligence and much more.

EUV lithography is important because it makes scaling more affordable for chipmakers and allows the semiconductor industry to continue its pursuit of Moore’s Law. EUV systems are used to print the most intricate layers on a chip, with the rest of the layers printed using various DUV systems. Both types of technology will be required in parallel for many years to come and we’re continuing to advance both technologies.  

A close-up of a motherboard and circuit board with a microprocessor chip embedded.

Mass producing leading-edge microchips

If you have a relatively new smartphone, one of the latest gaming consoles or a smart watch, it’s likely you’ve benefited directly from EUV lithography technology.

EXE systems

EXE systems are the latest generation in EUV lithography. The underlying technology is known as ‘High NA’, which stands for high numerical aperture. With an (NA) of 0.55, their innovative new optics use our novel 13.5 nm EUV light source to  provide higher contrast and print with a resolution of just 8 nm.


 The EXE platform will support high-volume chip manufacturing in 2025–2026, enabling geometric chip scaling into the next decade. That will include future advanced nodes, starting at the 2 nm Logic node and followed by Memory nodes at a similar density. By reducing the number of process steps in high-volume manufacturing, chipmakers will benefit from significant reductions in defects, cost and cycle time.

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NXE systems

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How does EUV work?

Explore inside an NXE lithography system 

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