ASML MaskTools licenses scattering-bar technology to IBM

ASML MaskTools, a wholly owned subsidiary of ASML, today announced that International Business Machines (IBM) (NYSE: IBM) has licensed ASML MaskTools patented scattering-bar technology for fabrication of application-specific integrated circuits (ASICs) with 130 nm (0.13 micron) design rules. The license allows IBM to begin using the optical extension technology to produce photomasks with advanced chip designs for both R&D and volume production.

This licensing agreement marks the first business between ASML MaskTools and IBM, the world's largest information technology company. ASML MaskTools scattering bar-technology extends optical imaging technology and significantly increases depth-of-focus at sub-wavelength regimes. This enables a wider process window and cost-effective photomasks, attributes that are especially beneficial in manufacturing ASICs. By enabling the design of sub-resolution features on a photomask, scattering-bar technology can greatly increase process yields for devices with 150 nm feature sizes and below. These sub-resolution features increase the depth of focus of the imaging process in the wafer fab. Optical extension techniques, such as optical proximity correction, phase shifting, scattering bars and off-axis illumination, are allowing semiconductor companies to extend the life of deep UV lithography well beyond the sub-wavelength barrier.

"Our scattering-bar technology is the industry's most advanced and complete manufacturing solution for next-generation devices using today's optical tools," said Doug Marsh, president of ASML MaskTools. "We are extremely proud that IBM, a leading global semiconductor company, has selected our technology to support its next-generation chip production capabilities."