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Configure your cookie settings and confirm to save your settings. You can withdraw or change your consent at any time on our cookie consent page.Press release - Tempe, Arizona, June 27, 2000
ASML has received an initial order from a major US semiconductor manufacturer for its new advanced technology 300 mm lithography systems. The first shipments of this new 300 mm technology to this customer are scheduled to begin in the third quarter of this year.
"This order from one of the industry's leading innovators in semiconductor manufacturing technology validates our technical leadership at a time when IC manufacturers worldwide are ramping up 300 mm wafer fabs," said Dave Chavoustie, ASML's executive vice president of worldwide sales. "The initial systems will be used by this customer in its advanced research center for the development of 300 mm manufacturing processes."
The new platform is specifically designed for 300 mm wafers, in addition to supporting 200 mm capability, and provides fundamental innovations in system architecture and stage design to meet the highest productivity requirements. It is designed to support multiple generations of optical lithography technologies from i-line to 157 nm. ASML plans a public introduction of the new platform at the industry's SEMICON West trade show in San Francisco in July.
About ASML
ASML, founded in 1984, is a world leader in advanced photolithography systems that are essential in the fabrication of integrated circuits. The company is publicly traded on both the Amsterdam Exchange and on the Nasdaq Stock Market under the symbol ASML. Visit the company's website at www.asml.com for more information.
Forward-looking statements
'Safe Harbor' Statement under the Private Securities Litigation Reform Act of 1995: Except for historical information, the matters discussed in this news release that may be considered forward-looking statements may be subject to certain risks and uncertainties that could cause the actual results to differ materially from those projected, including uncertainties in the market, pricing competition, procurement and manufacturing efficiencies, and other risks detailed from time to time in reports filed by the Company with the Securities and Exchange Commission. The Company assumes no obligation to update the information in this release.
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