ASML receives initial order for new 300 mm advanced technology

ASML has received an initial order from a major US semiconductor manufacturer for its new advanced technology 300 mm lithography systems. The first shipments of this new 300 mm technology to this customer are scheduled to begin in the third quarter of this year.

"This order from one of the industry's leading innovators in semiconductor manufacturing technology validates our technical leadership at a time when IC manufacturers worldwide are ramping up 300 mm wafer fabs," said Dave Chavoustie, ASML's executive vice president of worldwide sales. "The initial systems will be used by this customer in its advanced research center for the development of 300 mm manufacturing processes."

The new platform is specifically designed for 300 mm wafers, in addition to supporting 200 mm capability, and provides fundamental innovations in system architecture and stage design to meet the highest productivity requirements. It is designed to support multiple generations of optical lithography technologies from i-line to 157 nm. ASML plans a public introduction of the new platform at the industry's SEMICON West trade show in San Francisco in July.