Press release - Tempe, Arizona, August 17, 2000
Continuing to gain market momentum for its new 300 mm lithography platform, ASML has received another order for multiple TWINSCAN systems from a first-time customer. The customer is a leading US semiconductor manufacturer who will use the equipment for volume manufacture of advanced logic devices. The first unit in this order is scheduled for installation by the end of the year with volume production beginning in 2001.
"We are very pleased to be working with this new customer," said Dave Chavoustie, ASML's executive vice president of worldwide sales. "ASML has developed a significant new technology that will enable IC makers to realize the true productivity gains inherent in 300 mm volume production while operating at the limits of optical lithography."
This is the third TWINSCAN order announced within the past two months. ASML publicly introduced its new 300 mm system at the SEMICON West trade show in July. TWINSCAN is specifically designed for 300 mm wafer processing and incorporates fundamental innovations in system architecture and stage design to meet the highest productivity requirements. It is designed to support multiple generations of optical lithography technologies from i-line to 157 nm.
About ASML
ASM Lithography was founded in 1984 and is a world leader in advanced photolithography systems that are essential to the fabrication of modern integrated circuits. ASML is publicly traded on both the Amsterdam Exchanges and on the Nasdaq Stock Market under the symbol ASML. Visit the company's website at www.asml.com for more information.
Forward Looking Statements
'Safe Harbor' Statement under the Private Securities Litigation Reform Act of 1995: Except for historical information, the matters discussed in this news release that may be considered forward-looking statements may be subject to certain risks and uncertainties that could cause the actual results to differ materially from those projected, including uncertainties in the market, pricing competition, procurement and manufacturing efficiencies, and other risks detailed from time to time in reports filed by the Company with the Securities and Exchange Commission. The Company assumes no obligation to update the information in this release.
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