ASML enters atomic layer deposition market

ASML today entered the market for atomic layer deposition (ALD) technology through an exclusive technology licensing agreement with Integrated Process Systems (IPS). The agreement authorizes ASML to offer one of the fastest growing semiconductor process technologies, as well as associated production-proven processes and formulas developed in Korea, to customers around the globe.

ASML will further develop the ALD technology and the platform to deliver cost-effective solutions for depositing thin films. According to VLSI Research, the market for ALD is currently worth $80 million annually and expected to be worth more than $1 billion by 2006, reflecting a compound annual growth rate of approximately 109%.

"Atomic layer deposition is an exciting new technology that has shown tremendous potential for applications in high-k dielectric films, barrier materials and thin film deposition at the 90 nm node and below," said Jeffrey Kowalski, president, ASML Thermal. "ASML is committed to making this technology available to customers through our global infrastructure and manufacturing capability."

ALD technology is a surface-controlled process for thin film deposition that provides many advantages over previous generation chemical vapor deposition (CVD), including superior step coverage, uniformity and purity. The technology is being adopted for the production of ASICs, microprocessors, memory chips, digital signal processors and other integrated circuits.

ASML has committed to the aggressive investment, support and development of the ASML ALD product line, including the development of base and future technology, as well as sales and service programs. The licensing agreement also provides for joint manufacturing efforts by ASML and IPS.

"Our production-proven ALD technology, process and hardware, which has been very successful in the Korean market, is the industry's most advanced deposition solution for next-generation devices," said Yong-Han Lee, CEO and president of IPS.