ASML Special Applications introduces SA 5200 MEMS stepper

ASML Special Applications today introduced a new family of 5X i-line reduction steppers targeted for micro-electro-mechanical  systems (MEMS) and other applications such as compound semiconductors and ASICs. Through a dedicated options package, the new SA 5200 steppers, the SA 5200/45C and SA 5200/55C, can be optimized specifically for MEMS imaging.

The SA 5200 MEMS stepper is a fully integrated combination of a SA 5200/45C or /55C system and the MEMS 5201 options package. The MEMS stepper provides a way to meet new requirements for MEMS manufacturing performance, while offering manufacturers a MEMS stepper perfectly suited to volume, high-yield production.

"The SA 5200 MEMS stepper is optimized for volume manufacturing across a new range of devices in the emerging MEMS markets," said Eduard Hoeberichts, president of ASML Special Applications. "Based on close collaboration with customers, we have designed the MEMS 5201 options package to provide high productivity, while simultaneously meeting the demanding processing requirements of these devices."

The MEMS 5201 options package is a family of selectable capabilities for volume MEMS manufacturing, including 3DAlign , 3DMetrology and 2DStitching . The new capabilities allow for double-sided processing and for thick oxide, thick epi or CMP processing without the need for realignment schemes, resulting in a more cost-efficient and simple process flow. The SA 5200 MEMS stepper can also support focus-to-alignment-offset processing and large-die production through field stitching.

The MEMS industry is one of the fastest growing segments of the global electronics market. According to Cahners In-Stat Group, worldwide MEMS component sales are expected to grow from $3.8 billion in 2001 to $11 billion in 2005.

In addition to MEMS imaging, the SA 5200 steppers are designed to serve as volume production tools for application markets such as micro-electro-optical-mechanical systems (MOEMS), compound semiconductors and ASICs. These versatile steppers can easily be configured to handle various substrates, including silicon, gallium arsenide (GaAs) and indium phosphide (InP), and support wafer sizes ranging from two to six inches.