ASML speeds production of more sophisticated chips

It provides the following benefits to customers:

• Printing more sophisticated chips due to a reduced resolution of 80 nanometers. At 80 nanometers, approximately 3,000 features would fit along the edge of a salt crystal
• Allowing for additional shrink without transferring to new wavelengths due to 193-nanometer technology
• Processing multiple wafers simultaneously due to the TWINSCAN dual-stage system
• Increasing productivity due to printing more chips per wafer, especially with the use of 300-millimeter wafers

Industry estimates indicate that 15 300-millimeter fabs will be operational worldwide by the end of this year. The number may reach 40 by the end of 2007, with a combined capacity of 800,000 wafers per month.

“Chipmakers may invest as much as US$2.5 billion in a fab that operates on 300-millimeter technology. The return on investment needs to be achieved as quickly as possible,” said Doug Dunn, president and CEO, ASML. “This new lithography system reads like a case study for business success: more sophisticated chip design plus higher volume manufacturing equals greater potential profitability for ASML customers.”