ASML TWINSCAN C increases productivity by 15%

ASML Holding NV (ASML) today announced productivity performance enhancements for its TWINSCAN family of lithography systems. Called TWINSCAN C, the new enhancements increase throughput by approximately 15%, depending on product model.

The productivity enhancements in TWINSCAN C increase wafer output to over 110 wafers per hour for 300 mm wafers at real production conditions (109 exposures per wafer). The increased stage speeds in the TWINSCAN platform allow for these productivity improvements while maintaining imaging, alignment and leveling accuracy.

The TWINSCAN C product family will be available on four systems: the AT:400C, AT:750C, AT:850C and AT:1150C. The new systems are slated to begin shipping in the first quarter of 2003.

“Productivity is paramount to customers and, therefore, one of the key metrics for comparing lithography systems. TWINSCAN C fulfills ASML’s commitment to providing the highest levels of productivity at the highest levels of quality,” said Paul van Attekum, senior vice president, product marketing worldwide, ASML. “The increased stage speeds of the TWINSCAN C platform set the standard for wafer throughput, an important part of ASML's roadmap for continued improvement.”