Press release - Veldhoven, the Netherlands, June 6, 2007
ASML Holding NV (ASML) announces that it has successfully placed its inaugural Eurobond offering of €600 million Senior Notes due 2017. The bonds have been priced at an issue price of 99.651% and a coupon of 5.75% with settlement on June 13, 2007.
ASML issued the bond after announcing that its debt-to-equity ratio could be further optimized.
About ASML
ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and Nasdaq under the symbol 'ASML'.
This press release is not an offer for sale of, or a solicitation to purchase or subscribe for, any securities in the United States. The bonds discussed in this press release have not been, and will not be registered under the US Securities Act 1933, and may not be offered or sold in the United States absent registration or an exemption from registration thereunder.
Contact information
- Monique Mols
- Head of Media Relations
- +31652844418
- Sander Hofman
- Senior creative content strategist
- +31 6 2381 0214
- Brittney Wolff Zatezalo
- Corporate communications manager US
- +14084833207
- Skip Miller
- Head Investor Relations Worldwide
- +1 480 235 0934
- Marcel Kemp
- Head Investor Relations Europe
- +31 40 268 6494
- Peter Cheang
- Head Investor Relations Asia
- +886 3 6596771
