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ASML successfully places inaugural Eurobond issue for €600m

Press release - Veldhoven, the Netherlands, June 6, 2007

ASML Holding NV (ASML) announces that it has successfully placed its inaugural Eurobond offering of €600 million Senior Notes due 2017. The bonds have been priced at an issue price of 99.651% and a coupon of 5.75% with settlement on June 13, 2007.

 

ASML issued the bond after announcing that its debt-to-equity ratio could be further optimized.

About ASML


ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and Nasdaq under the symbol 'ASML'.

 

This press release is not an offer for sale of, or a solicitation to purchase or subscribe for, any securities in the United States. The bonds discussed in this press release have not been, and will not be registered under the US Securities Act 1933, and may not be offered or sold in the United States absent registration or an exemption from registration thereunder.

Contact information

Monique Mols

Head of Media Relations

Sander Hofman

Senior creative content strategist

Brittney Wolff Zatezalo

Corporate communications manager US

Skip Miller

VP Investor Relations – Worldwide

Marcel Kemp

Director Investor Relations – EU

Peter Cheang

Director Investor Relations – Asia