February 29, 2000
February 1, 2000
January 20, 2000
December 9, 1999
Signed joint marketing agreement
December 7, 1999
Order from White Oak Semiconductor
November 19, 1999
Exercise of over-allotment option
November 16, 1999
Bonds have aggregate principal amount of $400 million
November 3, 1999
Manufacturing future chip generations