ASML reaches agreement for delivery of EUV lithography systems

A minimum of 15 systems to be delivered

Press release - Veldhoven, the Netherlands, April 22, 2015

ASML Holding NV (ASML) today announces that it has signed an agreement with one of its major US customers to deliver a minimum of 15 ASML EUV lithography systems to support increased development activity and pilot production of future-generation manufacturing processes. The customer intends to use EUV lithography for multiple processing steps in future process technology nodes. The delivery of the first two NXE:3350B EUV systems is expected before the end of 2015. The new systems will be in addition to the existing EUV development systems already at the customer. Financial terms were not disclosed.

 

Extreme ultraviolet (EUV) lithography is the leading new patterning technology that simplifies the manufacturing process for the most advanced chips with significant benefits in terms of yield and cycle time. It will help the semiconductor industry to continue Moore's Law well into the next decade by packing more transistors on a chip, reducing cost-per-function and improving energy efficiency.

 

"EUV is now approaching volume introduction. Long-term EUV planning and EUV ecosystem preparation is greatly supported by this commitment to EUV, kick-starting a new round of innovation in the semiconductor industry. The commitment extends the planning horizon and increases the confidence in EUV," ASML president and Chief Executive Officer Peter Wennink said.

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