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ASML TWINSCAN NXT:1980Fi DUV lithography machine

TWINSCAN NXT:1980Fi

The dual-stage ArF immersion lithography system prints mid-critical layers on 300 mm wafers with industry-leading throughput.

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ArF light source

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Resolution

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Projection optics

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Wafers per hour

Key features & benefits

Chipmakers use the TWINSCAN NXT:1980Fi to print mid-critical chip layers – those just above the most sensitive transistor layers – in both advanced and mature semiconductor nodes. This system is designed for our customers who want faster printing and higher throughput to make their operations run more cost efficiently.

With ASML’s immersion technology at its core, the NXT:1980Fi offers a resolution of 38 nm, 2.5 nm machine-matched overlay and a throughput of 330 wafers per hour. The system benefits from a series of structural improvements that were introduced in the latest NXT platform and allow the system to run at extremely high speeds without compromising on overlay or resolution.


Faster stages are in large part behind the NXT:1980Fi’s increased productivity. Design improvements to the immersion hood, a complex component that helps control the water in immersion systems, reduce defects. And enhancements in the control of optical heating effects increase the system’s productivity by maintaining its overlay accuracy.