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Key features & benefits
In addition to increased productivity, the XT:400L introduces new options to assist advanced applications with high topography (such as 3D-NAND) and small CD and CDU (such as critical layers in Logic or analog applications).
Just like previous models, the XT:400L is a dual-stage lithography system designed for volume production of 200 mm and 300 mm wafers down to a 220 nm resolution.
High throughput and yield are combined with fast reticle exchange times and lot streaming to provide the lowest cost of operation.
01. Productivity
The TWINSCAN XT:400L is able to achieve a throughput of ≥ 230 300 mm wafers per hour (≥ 220 using the high-resolution option), and ≥ 250 200 mm wafers per hour. Thanks to a bridge tool, customers are able to convert between 200 mm and 300 mm wafers with less than a week of machine downtime.
02. Optics
The TWINSCAN XT:400L contains a variable 0.65 NA 365 nm projection lens with an advanced lens manipulator and imaging enhancement options. Customers can achieve a production resolution of 350 nm (standard), 280 nm (annular illumination), or 220 nm (annular illumination plus high-resolution option).
