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TWINSCAN XT860N

TWINSCAN XT:860N

ASML's TWINSCAN XT:860N is designed using state-of-the-art optics for volume 200 and 300 mm wafer production at and below 110 nm resolution.

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Key features & benefits

The TWINSCAN XT:860N step-and-scan system is a high-productivity, dual-stage KrF lithography machine designed for volume production of 200 and 300 mm wafers at and below 110 nm resolution.

By combining the imaging power of a variable 0.55–0.80 NA ZEISS Starlith 860+ 4X reduction lens with AERIAL II and the optional QUASAR XL illuminator technology, the XT:860N extends today’s volume-proven KrF technology to 110 nm applications.

01.Productivity

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The AERIAL II Illuminator also enables continuous-variable conventional and off-axis illumination with zoom optics, and the system’s high-speed, dual-stage technology helps to maintain these high throughput levels over a wide range of resist sensitivities.

02. Optics

The TWINSCAN XT:860N step-and-scan system includes a variable 0.80 NA 248 nm 860+ projection lens to attain very low aberration levels for tight focal planes and excellent distortion control with annular distortion of ≤ 10 nm.

03. Imaging performance

The TWINSCAN XT:860N step-and-scan system can achieve a ≤ 7.5 nm matched-machine (to reference wafer) full-wafer-coverage overlay. The system’s LithoGuide ILIAS sensor allows customers to more accurately set up the system and monitor its imaging parameters.

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