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ASML YieldStar 375F optical metrology system

Metrology & inspection systems

YieldStar 375F

Fast and accurate pre-etch overlay and focus measurements, whatever your process conditions.

Key features & benefits

The YieldStar 375F optical metrology system offers fast and accurate monitoring of on-product overlay and focus performance through diffraction-based measurements.

It targets post-exposure, pre-etch metrology for processes monitoring and control as well as for lithography system stability and matching.

 

Available in track-integrated and standalone versions, it is the first YieldStar system to offer continuous wavelength operation for maximum measurement accuracy in any process conditions.

01. Precision measurements

The YieldStar 375F offers the nanometer-level precision necessary to monitor and control processes for today’s most advanced chips.


02. More speed, more data

The YieldStar 375F has a throughput to match the productivity of our fastest lithography systems. It can measure thousands of data points per lot and do so faster than previous solutions, reducing chipmakers’ metrology costs.


03. Process robustness

Thanks to a new illuminator and sensor, the YieldStar 375F offers a continuous wavelength selection between 425 and 885 nm. This allows chipmakers to precisely optimize the measurement wavelength to suit their specific layer stack.

Computational metrology option

Our computational metrology option provides our customers with a high-density overlay map for every single TWINSCAN production wafer without increasing the metrology capacity. Through advanced computer modeling, it combines the high-density pre-exposure wafer mapping already carried out on every wafer by our TWINSCAN lithography systems with YieldStar metrology data. The resulting dense focus and overlay maps enable wafer-level process control that can improve overlay performance by 10-20%.