Key features & benefits
The YieldStar 1390 is the successor to the YieldStar 1385. It enables chipmakers to quickly and accurately measure in-device overlay with nanometer-level precision.
With post-etch metrology, chipmakers can monitor overlay directly on device structures, and they can do it faster than with scanning electron microscope solutions. This keeps costs down while improving overlay performance and chip yield and providing better insight into production process performance.
The YieldStar 1390 offers increased throughput and accuracy thanks to a new higher-intensity light source. Additionally, advances in the system’s machine learning algorithm and signal processing extend its post-etch metrology applications to in-device tilt and critical dimension (CD).
