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Key features & benefits
The TWINSCAN NXE:3400B supports EUV volume production at the 7 and 5 nm nodes.
Combining productivity, excellent image resolution, matched overlay to EUV NXE and ArFi NXT tools and focus performance, the NXE:3400B provides lithography capability complementary to ASML’s ArFi technology.
01. Productivity
The 300 mm wafer throughput target specification for the NXE:3400B is larger than or equal to 125 wafers per hour under the following conditions: Dose: 20mJ/cm2, die size: 26 x 33 mm, 96 shots.
