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Key features & benefits
The TWINSCAN NXT:1470 193 nm step-and-scan system is the first ever “dry” lithography system built on our high-productivity, high-precision NXT platform. As a result, it is the first dry system to achieve on-product overlay better than 4.5 nm – and the first lithography machine of any kind capable of processing more than 300 wafers per hour.
With its outstanding overlay and throughput performance, this dual-stage ArF lithography tool helps chip manufacturers reduce cost per exposure while producing up to 50% more wafers from the same lithocell footprint. It will enable the planned KrF NXT systems to further reduce the cost of chip production while improving matched-machine overlay for higher yields.
01. Productivity
With its NXT body – featuring a new generation of wafer stage module – the NXT:1470 delivers up to 50% greater throughput than our previous fastest ArF system. It is supported by an ongoing roadmap to increase productivity even further, helping manufacturers continue to improve the cost effectiveness of high-volume chip production.
02. Optics
The TWINSCAN NXT:1470 features a variable-NA (0.70 – 0.93) Carl Zeiss Starlith 4X reduction lens. Compared to our previous dry ArF lithography systems, it includes an additional lens element and enhanced improvements for lens heating control.
