ASML is one of the world’s leading manufacturers of chip-making equipment. Headquartered in Veldhoven, the Netherlands, ASML employs more than 16,500 people.
ASML’s TWINSCAN NXE platform is the industry’s first production platform for extreme ultraviolet lithography (EUVL). The NXE:3350B is the successor to the NXE:3300B, offering 16 nm resolution with off-axis illumination as well as improved overlay and focus performance.
The NXE Step-and-Scan systems use 13.5 nm EUV light, generated by a tin-based plasma source. The systems feature all-reflective 4x reduction optics from Carl Zeiss SMT with a numerical aperture (NA) of 0.33 and a maximum exposure field of 26 mm by 33 mm.
For the NXE:3350B, off-axis illumination as well as FlexPupil will be standard.
|Resolution||≤ 16 nm|
|Productivity||≥ 125 wph|
The NXE:3350B is configured with two wafer stages, one operating in the metrology position and one operating in the exposure position. The two wafer stages operate concurrently and independently. During imaging, the wafer stage in the exposure position operates synchronously with the reticle stage. The high maximum wafer scanning speed allows maximum use of the source intensity over the largest possible resist sensitivity and exposure dose range, thereby maximizing throughput. Both the wafer and reticle scanning stages have active servo control over all six degrees of freedom.
Off-axis Illumination and FlexPupil
The NXE:3350B illumination system supports six dedicated off-axis illumination settings, in addition to the conventional illumination setting. To allow even greater flexibility in defining illumination pupil shapes, FlexPupil is also included.
Wafer Alignment with SMASH and leveling with UVLS
Wafer alignment occurs at the measurement position with target detection using the new SMASH Mk3.3 alignment sensors with ASML's proven phase grating alignment technique, supporting X&Y combined marks. The NXE:3350B is equipped with the new UV Level Sensor which reduces the process dependency of the leveling accuracy.